Aluminium Heat Dissipation | Thermal Conductivity

1. Thermal Conductivity of Aluminum

Heat SinkAluminium is the material of choice for heat dissipation in modern thermal management systems, thanks to its unique balance of thermal conductivity, lightweight properties, and cost efficiency. With a thermal conductivity ranging from 160–220 W/(m·K)(depending on alloy composition), aluminium efficiently transfers heat while being 3x lighter than copper and far more affordable.

Thermal Performance Comparison: Aluminum vs. Copper Heat Sinks

MetricDisipador de calor de aluminioCopper Heat SinkSteel Heat Sink
Conductividad térmica160–220 W/(m·K) <br>(Pure Al: ~237)~398 W/(m·K)~50–80 W/(m·K)
Specific Heat Capacity0.9 J/g·K (fast thermal response)0.385 J/g·K (slower response)~0.45 J/g·K (moderate response)
Surface Emissivity0.1 (polished) → 0.8–0.9 (black anodized)0.03–0.1 (natural)~0.1–0.3 (depends on surface finish)
Contact Thermal Resistance0.1–0.5 K·cm²/W (with TIMs)<0.1 K·cm²/W (lower resistance)~0.5–1.0 K·cm²/W (higher resistance)
Densidad2.7 g/cm³ (lightweight)8.96 g/cm³ (heavy)7.87 g/cm³ (moderate weight)
CosteLow (cost-effective for mass production)High (3–5× more expensive than Al)Very Low (cheapest option)

2. Aluminum Alloy Grades Impact Heat Dissipation

When designing an aluminum heat sink, selecting the right alloy is critical for balancing thermal performance, mechanical strength, and manufacturability. While pure aluminum offers the highest thermal conductivity, most industrial applications use alloyed aluminum to improve durability and ease of production.

2.1 Pure Aluminum (1xxx Series) – Best Conductivity, Weak Strength

Key Alloys: 1050, 1060, 1100

PropiedadValorImpact on Heat Dissipation
Conductividad térmica~200–237 W/(m·K)Highest possible for Al, ideal for thermal transfer.
Resistencia a la tracción70–110 MPaToo weak for structural applications.
Typical UseThin-fin heat sinks, LED cooling. 

Pros:
Best thermal performance among aluminum alloys.
✔ Easy to extrude into complex fin shapes.

Cons:
Low mechanical strength – prone to bending under stress.
Rarely used in high-vibration environments (e.g., automotive).

2.2 6xxx Series (6061, 6063) – The Industry Standard

Most Common Alloys: 6061-T6, 6063-T5

Propiedad6063-T56061-T6Impact on Heat Sinks
Conductividad térmica~200 W/(m·K)~170 W/(m·K)Slightly lower than pure Al but still efficient.
Resistencia a la tracción186 MPa310 MPaStrong enough for most applications.
ExtrudabilityExcelenteBien6063 is easier to shape into thin fins.

Amplifier Heat SinkWhy 6xxx Series Dominates?
Balanced thermal & mechanical properties – ideal for electronics, automotive, and industrial heat sinks.
6063-T5 is the go-to alloy for extruded heat sinks (common in CPU coolers).
6061-T6 is stronger, used in high-stress environments (e.g., power converters).

Trade-off:
~10–20% lower conductivity than pure aluminum.

2.3 5xxx Series (5052, 5083) – Corrosion-Resistant but Poor Conductivity

Key Alloys: 5052, 5083

PropiedadValorImpact on Heat Dissipation
Conductividad térmica~120–140 W/(m·K)Significantly worse than 6xxx series.
Resistencia a la tracción210–290 MPaStronger than 6063 but harder to extrude.
Resistencia a la corrosiónExcelenteGood for marine/high-humidity environments.

Amplifier Heat Sink (3)When to Use?
Outdoor or corrosive environments (e.g., marine electronics).
Structural components needing moderate cooling.

Avoid If:
Thermal performance is critical (conductivity is ~40% lower than 6063).

2.4 2xxx & 7xxx Series (2024, 7075) – High Strength, Worst Conductivity

Key Alloys: 2024-T6, 7075-T6

PropiedadValorImpact on Heat Sinks
Conductividad térmica~120–150 W/(m·K)Poor heat dissipation.
Resistencia a la tracción400–570 MPaUsed in aerospace/defense.
MaquinabilidadExcelenteHard to extrude; often CNC-machined.

Why Avoid for Heat Sinks?
Very low thermal conductivity (~50% of 6063).
Expensive and overkill unless extreme strength is needed.

Exception:
Aerospace heat sinks where weight and strength matter more than cooling efficiency.

2.5 Specialized Alloys (Al-SiC, Al-Graphite) – High Performance, High Cost

Example: Al-SiC (Silicon Carbide Reinforced)

PropiedadValorImpact on Heat Dissipation
Conductividad térmica250–300 W/(m·K)Better than pure aluminum.
CTE (Coeff. of Thermal Expansion)Matches semiconductors (e.g., Si, GaAs).Reduces thermal stress in high-power electronics.
Coste5–10× standard Al alloys.Only justified in niche applications.

extrusión de disipadores de calor redondosBest For:
High-power laser diodes, RF amplifiers, aerospace electronics.
Where CTE matching is critical (e.g., power modules).

Drawback:
Extremely expensive – not viable for consumer products.

Summary: Choosing the Right Alloy for Your Heat Sink

Alloy SeriesBest ForConductividad térmicaFuerzaCoste
1xxx (Pure Al)Thin-fin heat sinks, LEDs★★★★★ (~237 W/(m·K))★★☆☆☆$
6xxx (6063, 6061)Electronics, automotive★★★★☆ (~200 W/(m·K))★★★★☆$$
5xxx (5052, 5083)Marine/outdoor use★★☆☆☆ (~130 W/(m·K))★★★☆☆$$
2xxx/7xxx (2024, 7075)Aerospace/defense★★☆☆☆ (~140 W/(m·K))★★★★★$$$$
Al-SiC CompositesHigh-power RF, lasers★★★★★ (~300 W/(m·K))★★★★☆$$$$$

3. Impact of Structure on Aluminum Cooling

While material selection is critical, the structural design of a heat sink plays an equally important role in heat dissipation efficiency. Even the best aluminum alloy will underperform if the geometry and airflow dynamics are poorly optimized.

3.1 Fin Geometry: The Heart of Heat Dissipation

The fins are responsible for maximizing surface area to transfer heat to the surrounding air. Key parameters include:

(1) Fin Height (H) & Spacing (P)

ParámetroOptimal RangeToo LowToo High
Height (H)5–50 mm (natural convection)<br>10–100 mm (forced air)Reduced surface areaAirflow blockage (natural convection)
Spacing (P)3–15 mm (depends on airflow)Airflow resistanceReduced heat transfer area

Design Tip:

  • Para natural convection, use taller fins (20–50 mm) with wider spacing (5–15 mm)to allow hot air to rise.
  • Para forced air cooling, shorter fins (10–30 mm) with tighter spacing (3–8 mm)improve turbulence.

(2) Fin Shape & Surface Texture

Fin TypeAdvantageBest Use Case
Straight FinsEasy to manufactureLow-cost electronics
Pin Fins20–30% more surface areaCompact spaces (e.g., GPU coolers)
Wave/Offset FinsDisrupts laminar flow → better turbulenceHigh-speed forced air (servers, telecom)
Textured/Sandblasted+10–15% convection efficiencyPassive cooling (no fan)

3.2 Base Plate Design: The Thermal Bridge

The base plate transfers heat from the source (e.g., CPU) to the fins. Key considerations:

ParámetroOptimal ValueImpacto en el rendimiento
Espesor3–10 mmToo thin → heat congestion<br>Too thick → unnecessary weight
Flatness≤0.05 mm/mPoor flatness increases thermal resistance
MaterialCopper base + Al fins (hybrid)Better for high-power chips (e.g., CPUs)

Disipador de calor de aluminioCritical Note:

  • A 6 mm-thick aluminum base is standard for most electronics.
  • Para >100W heat loads, a copper core or vapor chamber is recommended.

3.3 Heat Pipes & Vapor Chambers: Boosting Efficiency

When aluminum’s lateral conductivity is insufficient, phase-change technologies help spread heat evenly.

TechnologyHow It WorksBest For
Heat PipesEvaporates/condenses fluid to transfer heatLaptops, CPU coolers
Vapor ChambersFlat, two-dimensional heat spreaderHigh-power GPUs, LEDs

_Round Aluminum Heatsink (2)Performance Gain:

  • Heat pipes can reduce thermal resistance by 40–60% vs. pure aluminum.
  • Vapor chambers are ideal for >150W/cm² hotspots.

4. Surface Treatment Effects on Aluminum Cooling

While material selection and structural design are critical for heat sink performance, surface treatments play a vital role in enhancing heat dissipation efficiency, corrosion resistance, and long-term reliability. Different treatments can improve thermal radiation, convection, and even interfacial heat transfer.

4.1 Anodizing: The Gold Standard for Aluminum Heat Sinks

Anodizado creates a controlled oxide layer on aluminum, improving durability and thermal emissivity.

Types of Anodizing & Their Impact

TypeEspesorEmissivity (ε)Thermal Conductivity ImpactBest Use Case
Clear Anodizing5–25 µm0.1–0.2 (low)Slight reduction (~5–10%)General-purpose heat sinks
Black Anodizing10–25 µm0.8–0.9 (high)Moderate reduction (~10–15%)Passive cooling, radiative heat transfer
Anodizado duro25–100 µm0.3–0.5Significant reduction (~20–30%)High-wear industrial applications

Disipador de calor de aluminio (3)Key Benefits:
Corrosion resistance – Protects against oxidation and chemical exposure.
Improved emissivity (black anodizing) – Boosts radiative cooling by 8–10× vs. bare aluminum.
Electrical insulation – Prevents short circuits in electronics.

Trade-offs:
Reduced thermal conductivity – The oxide layer is less conductive than pure aluminum.
Thicker coatings increase thermal resistance – Keep anodizing <15 µm for optimal heat transfer.

4.2 Chemical Conversion Coatings (Chromate/Phosphate)

These thin coatings enhance corrosion resistance without significantly affecting thermal performance.

Coating TypeEspesorEffect on Heat TransferBest Use Case
Chromate Conversion0.5–2 µmNegligible impactMilitary, aerospace (where toxicity is acceptable)
Phosphate Coating1–5 µmSlight reduction (~3–5%)Automotive, industrial heat sinks

Ventajas:
Very thin – Minimal impact on thermal resistance.
Improves paint/adhesive bonding – Useful for coated heat sinks.

Disadvantages:
Limited emissivity improvement – Not as effective as anodizing for radiative cooling.

4.3 Powder Coating & Paint: Aesthetic but Thermally Restrictive

Recubrimiento en polvo provides color and protection but can hinder heat dissipation.

ParámetroTypical ImpactRecommendation
Espesor30–100 µmAvoid on high-power heat sinks
Emissivity0.4–0.8 (depends on color)Black paint helps slightly
Thermal ResistanceHigh (20–50% reduction in cooling)Use only on low-power or decorative heat sinks

Disipador de calor de aluminioWhen to Use?

  • Consumer electronics where appearance matters.
  • Low-power applications (e.g., LED housings).

Avoid If:

  • High thermal performance is needed – The coating acts as an insulator.

4.4 Mechanical Texturing (Sandblasting, Brushing)

Altering surface roughness can improve convection efficiency.

TreatmentSurface Roughness (Ra)Effect on Cooling
Chorro de arena3–10 µm+10–15% convection efficiency
Cepillado1–5 µm+5–10% convection efficiency

Pros:
No added thermal resistance – Only modifies surface texture.
Cost-effective – No chemical processes required.

Cons:
No improvement in radiative cooling – Only aids convection.

Best For:

  • Forced-air cooling systems (e.g., server heat sinks).
  • Industrial heat exchangers.

4.5 Plating (Nickel, Silver, Gold) – Niche but Effective

Electroplating can enhance conductivity or corrosion resistance.

Plating TypeConductividad térmicaBest Use CaseDrawback
Nickel Plating~90 W/(m·K)Corrosion protectionAdds ~0.2 K·cm²/W thermal resistance
Silver Plating~429 W/(m·K)Ultra-high-performance coolingExpensive, tarnishes over time
Gold Plating~318 W/(m·K)RF/space applications (oxidation-proof)Extremely costly

When to Consider?

  • Silver plating for extreme thermal performance (e.g., superconductors).
  • Nickel plating for humid/marine environments.

Summary: Choosing the Right Surface Treatment

TreatmentBest ForThermal ImpactCoste
Black AnodizingPassive cooling, high emissivity★★★★☆ (optimal radiation)$$
Clear AnodizingGeneral corrosion protection★★★☆☆ (minimal impact)$
Chorro de arenaForced convection improvement★★★★☆ (better airflow)$
Nickel PlatingMarine/outdoor use★★☆☆☆ (adds resistance)$$$
Recubrimiento en polvoAesthetic applications★☆☆☆☆ (insulating)$$
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