Aluminium Heat Dissipation | Thermal Conductivity

1. Thermal Conductivity of Aluminum

Heat SinkAluminium is the material of choice for heat dissipation in modern thermal management systems, thanks to its unique balance of thermal conductivity, lightweight properties, and cost efficiency. With a thermal conductivity ranging from 160–220 W/(m·K)(depending on alloy composition), aluminium efficiently transfers heat while being 3x lighter than copper and far more affordable.

Thermal Performance Comparison: Aluminum vs. Copper Heat Sinks

Metricمشتت حراري من الألومنيومCopper Heat SinkSteel Heat Sink
التوصيل الحراري160–220 W/(m·K) <br>(Pure Al: ~237)~398 W/(m·K)~50–80 W/(m·K)
Specific Heat Capacity0.9 J/g·K (fast thermal response)0.385 J/g·K (slower response)~0.45 J/g·K (moderate response)
Surface Emissivity0.1 (polished) → 0.8–0.9 (black anodized)0.03–0.1 (natural)~0.1–0.3 (depends on surface finish)
Contact Thermal Resistance0.1–0.5 K·cm²/W (with TIMs)<0.1 K·cm²/W (lower resistance)~0.5–1.0 K·cm²/W (higher resistance)
الكثافة2.7 g/cm³ (lightweight)8.96 g/cm³ (heavy)7.87 g/cm³ (moderate weight)
يكلفLow (cost-effective for mass production)High (3–5× more expensive than Al)Very Low (cheapest option)

2. Aluminum Alloy Grades Impact Heat Dissipation

When designing an aluminum heat sink, selecting the right alloy is critical for balancing thermal performance, mechanical strength, and manufacturability. While pure aluminum offers the highest thermal conductivity, most industrial applications use alloyed aluminum to improve durability and ease of production.

2.1 Pure Aluminum (1xxx Series) – Best Conductivity, Weak Strength

Key Alloys: 1050, 1060, 1100

ملكيةالقيمةImpact on Heat Dissipation
التوصيل الحراري~200–237 W/(m·K)Highest possible for Al, ideal for thermal transfer.
قوة الشد70–110 MPaToo weak for structural applications.
Typical UseThin-fin heat sinks, LED cooling. 

Pros:
Best thermal performance among aluminum alloys.
✔ Easy to extrude into complex fin shapes.

Cons:
Low mechanical strength – prone to bending under stress.
Rarely used in high-vibration environments (e.g., automotive).

2.2 6xxx Series (6061, 6063) – The Industry Standard

Most Common Alloys: 6061-T6, 6063-T5

ملكية6063-T56061-T6Impact on Heat Sinks
التوصيل الحراري~200 W/(m·K)~170 W/(m·K)Slightly lower than pure Al but still efficient.
قوة الشد186 MPa310 MPaStrong enough for most applications.
Extrudabilityممتازجيد6063 is easier to shape into thin fins.

Amplifier Heat SinkWhy 6xxx Series Dominates?
Balanced thermal & mechanical properties – ideal for electronics, automotive, and industrial heat sinks.
6063-T5 is the go-to alloy for extruded heat sinks (common in CPU coolers).
6061-T6 is stronger, used in high-stress environments (e.g., power converters).

Trade-off:
~10–20% lower conductivity than pure aluminum.

2.3 5xxx Series (5052, 5083) – Corrosion-Resistant but Poor Conductivity

Key Alloys: 5052, 5083

ملكيةالقيمةImpact on Heat Dissipation
التوصيل الحراري~120–140 W/(m·K)Significantly worse than 6xxx series.
قوة الشد210–290 MPaStronger than 6063 but harder to extrude.
مقاومة التآكلممتازGood for marine/high-humidity environments.

Amplifier Heat Sink (3)When to Use?
Outdoor or corrosive environments (e.g., marine electronics).
Structural components needing moderate cooling.

Avoid If:
Thermal performance is critical (conductivity is ~40% lower than 6063).

2.4 2xxx & 7xxx Series (2024, 7075) – High Strength, Worst Conductivity

Key Alloys: 2024-T6, 7075-T6

ملكيةالقيمةImpact on Heat Sinks
التوصيل الحراري~120–150 W/(m·K)Poor heat dissipation.
قوة الشد400–570 MPaUsed in aerospace/defense.
قابلية التصنيعممتازHard to extrude; often CNC-machined.

Why Avoid for Heat Sinks?
Very low thermal conductivity (~50% of 6063).
Expensive and overkill unless extreme strength is needed.

Exception:
Aerospace heat sinks where weight and strength matter more than cooling efficiency.

2.5 Specialized Alloys (Al-SiC, Al-Graphite) – High Performance, High Cost

Example: Al-SiC (Silicon Carbide Reinforced)

ملكيةالقيمةImpact on Heat Dissipation
التوصيل الحراري250–300 W/(m·K)Better than pure aluminum.
CTE (Coeff. of Thermal Expansion)Matches semiconductors (e.g., Si, GaAs).Reduces thermal stress in high-power electronics.
يكلف5–10× standard Al alloys.Only justified in niche applications.

بثق المشتت الحراري الدائريBest For:
High-power laser diodes, RF amplifiers, aerospace electronics.
Where CTE matching is critical (e.g., power modules).

Drawback:
Extremely expensive – not viable for consumer products.

Summary: Choosing the Right Alloy for Your Heat Sink

Alloy SeriesBest Forالتوصيل الحراريقوةيكلف
1xxx (Pure Al)Thin-fin heat sinks, LEDs★★★★★ (~237 W/(m·K))★★☆☆☆$
6xxx (6063, 6061)Electronics, automotive★★★★☆ (~200 W/(m·K))★★★★☆$$
5xxx (5052, 5083)Marine/outdoor use★★☆☆☆ (~130 W/(m·K))★★★☆☆$$
2xxx/7xxx (2024, 7075)Aerospace/defense★★☆☆☆ (~140 W/(m·K))★★★★★$$$$
Al-SiC CompositesHigh-power RF, lasers★★★★★ (~300 W/(m·K))★★★★☆$$$$$

3. Impact of Structure on Aluminum Cooling

While material selection is critical, the structural design of a heat sink plays an equally important role in heat dissipation efficiency. Even the best aluminum alloy will underperform if the geometry and airflow dynamics are poorly optimized.

3.1 Fin Geometry: The Heart of Heat Dissipation

The fins are responsible for maximizing surface area to transfer heat to the surrounding air. Key parameters include:

(1) Fin Height (H) & Spacing (P)

المعلمةOptimal RangeToo LowToo High
Height (H)5–50 mm (natural convection)<br>10–100 mm (forced air)Reduced surface areaAirflow blockage (natural convection)
Spacing (P)3–15 mm (depends on airflow)Airflow resistanceReduced heat transfer area

Design Tip:

  • ل natural convection, use taller fins (20–50 mm) with wider spacing (5–15 mm)to allow hot air to rise.
  • ل forced air cooling, shorter fins (10–30 mm) with tighter spacing (3–8 mm)improve turbulence.

(2) Fin Shape & Surface Texture

Fin TypeAdvantageBest Use Case
Straight FinsEasy to manufactureLow-cost electronics
Pin Fins20–30% more surface areaCompact spaces (e.g., GPU coolers)
Wave/Offset FinsDisrupts laminar flow → better turbulenceHigh-speed forced air (servers, telecom)
Textured/Sandblasted+10–15% convection efficiencyPassive cooling (no fan)

3.2 Base Plate Design: The Thermal Bridge

The base plate transfers heat from the source (e.g., CPU) to the fins. Key considerations:

المعلمةOptimal Valueالتأثير على الأداء
سماكة3–10 mmToo thin → heat congestion<br>Too thick → unnecessary weight
Flatness≤0.05 mm/mPoor flatness increases thermal resistance
مادةCopper base + Al fins (hybrid)Better for high-power chips (e.g., CPUs)

مشتت حراري من الألومنيومCritical Note:

  • أ 6 mm-thick aluminum base is standard for most electronics.
  • ل >100W heat loads, a copper core or vapor chamber is recommended.

3.3 Heat Pipes & Vapor Chambers: Boosting Efficiency

When aluminum’s lateral conductivity is insufficient, phase-change technologies help spread heat evenly.

TechnologyHow It WorksBest For
Heat PipesEvaporates/condenses fluid to transfer heatLaptops, CPU coolers
Vapor ChambersFlat, two-dimensional heat spreaderHigh-power GPUs, LEDs

_Round Aluminum Heatsink (2)Performance Gain:

  • Heat pipes can reduce thermal resistance by 40–60% vs. pure aluminum.
  • Vapor chambers are ideal for >150W/cm² hotspots.

4. Surface Treatment Effects on Aluminum Cooling

While material selection and structural design are critical for heat sink performance, surface treatments play a vital role in enhancing heat dissipation efficiency, corrosion resistance, and long-term reliability. Different treatments can improve thermal radiation, convection, and even interfacial heat transfer.

4.1 Anodizing: The Gold Standard for Aluminum Heat Sinks

الأكسدة creates a controlled oxide layer on aluminum, improving durability and thermal emissivity.

Types of Anodizing & Their Impact

TypeسماكةEmissivity (ε)Thermal Conductivity ImpactBest Use Case
Clear Anodizing5–25 µm0.1–0.2 (low)Slight reduction (~5–10%)General-purpose heat sinks
Black Anodizing10–25 µm0.8–0.9 (high)Moderate reduction (~10–15%)Passive cooling, radiative heat transfer
الأكسدة الصلبة25–100 µm0.3–0.5Significant reduction (~20–30%)High-wear industrial applications

ضميمة المشتت الحراري المصنوعة من الألومنيوم (3)Key Benefits:
Corrosion resistance – Protects against oxidation and chemical exposure.
Improved emissivity (black anodizing) – Boosts radiative cooling by 8–10× vs. bare aluminum.
Electrical insulation – Prevents short circuits in electronics.

Trade-offs:
Reduced thermal conductivity – The oxide layer is less conductive than pure aluminum.
Thicker coatings increase thermal resistance – Keep anodizing <15 µm for optimal heat transfer.

4.2 Chemical Conversion Coatings (Chromate/Phosphate)

These thin coatings enhance corrosion resistance without significantly affecting thermal performance.

Coating TypeسماكةEffect on Heat TransferBest Use Case
Chromate Conversion0.5–2 µmNegligible impactMilitary, aerospace (where toxicity is acceptable)
Phosphate Coating1–5 µmSlight reduction (~3–5%)Automotive, industrial heat sinks

المميزات:
Very thin – Minimal impact on thermal resistance.
Improves paint/adhesive bonding – Useful for coated heat sinks.

Disadvantages:
Limited emissivity improvement – Not as effective as anodizing for radiative cooling.

4.3 Powder Coating & Paint: Aesthetic but Thermally Restrictive

طلاء مسحوق provides color and protection but can hinder heat dissipation.

المعلمةTypical ImpactRecommendation
سماكة30–100 µmAvoid on high-power heat sinks
Emissivity0.4–0.8 (depends on color)Black paint helps slightly
Thermal ResistanceHigh (20–50% reduction in cooling)Use only on low-power or decorative heat sinks

ضميمة بالوعة حرارية من الألومنيومWhen to Use?

  • Consumer electronics where appearance matters.
  • Low-power applications (e.g., LED housings).

Avoid If:

  • High thermal performance is needed – The coating acts as an insulator.

4.4 Mechanical Texturing (Sandblasting, Brushing)

Altering surface roughness can improve convection efficiency.

TreatmentSurface Roughness (Ra)Effect on Cooling
النفخ الرملي3–10 µm+10–15% convection efficiency
تنظيف الأسنان بالفرشاة1–5 µm+5–10% convection efficiency

Pros:
No added thermal resistance – Only modifies surface texture.
Cost-effective – No chemical processes required.

Cons:
No improvement in radiative cooling – Only aids convection.

Best For:

  • Forced-air cooling systems (e.g., server heat sinks).
  • Industrial heat exchangers.

4.5 Plating (Nickel, Silver, Gold) – Niche but Effective

Electroplating can enhance conductivity or corrosion resistance.

Plating Typeالتوصيل الحراريBest Use CaseDrawback
Nickel Plating~90 W/(m·K)Corrosion protectionAdds ~0.2 K·cm²/W thermal resistance
Silver Plating~429 W/(m·K)Ultra-high-performance coolingExpensive, tarnishes over time
Gold Plating~318 W/(m·K)RF/space applications (oxidation-proof)Extremely costly

When to Consider?

  • Silver plating for extreme thermal performance (e.g., superconductors).
  • Nickel plating for humid/marine environments.

Summary: Choosing the Right Surface Treatment

TreatmentBest ForThermal Impactيكلف
Black AnodizingPassive cooling, high emissivity★★★★☆ (optimal radiation)$$
Clear AnodizingGeneral corrosion protection★★★☆☆ (minimal impact)$
النفخ الرمليForced convection improvement★★★★☆ (better airflow)$
Nickel PlatingMarine/outdoor use★★☆☆☆ (adds resistance)$$$
طلاء المسحوقAesthetic applications★☆☆☆☆ (insulating)$$
AR
انتقل إلى الأعلى
+86 182 9640 4265